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HomeWhat are the production process difficulties and automated production improvement paths for artificial intelligence ink screen mobile phone cases?

What are the production process difficulties and automated production improvement paths for artificial intelligence ink screen mobile phone cases?

Publish Time: 2025-04-16
The AI ink screen mobile phone case integrates intelligence and display technology. Its production process involves the integration of multiple fields of technology, and automated production also faces many challenges.

As the core component of the AI mobile phone case, the ink screen itself has a high degree of difficulty in its production process. The ink screen adopts electrophoretic display technology, and the display effect is achieved by moving charged pigment particles under the action of an electric field. During the manufacturing process, the preparation of microcapsules needs to be precisely controlled. Parameters such as the diameter, wall thickness, and distribution of internal pigment particles of the microcapsules will directly affect the display effect and service life. If the size of the microcapsules is uneven, it will cause problems such as color difference and afterimage in the display screen; if the wall thickness is not properly controlled, the microcapsules may break during subsequent processing or use, affecting the performance of the ink screen. In addition, the production of the ink screen electrode also requires extremely high precision. The flatness, conductivity, and fit of the electrode with the microcapsule layer will affect the uniformity of the electric field, and thus affect the display quality. At present, the production process of the ink screen is not mature yet, and the yield rate is low. This undoubtedly increases the production cost and production cycle of the AI ink screen mobile phone case, and becomes a major difficulty in the production process.

Artificial intelligence ink screen mobile phone cases need to integrate AI chips, sensors, wireless communication modules and other electronic components. The miniaturization and precision of these components increase the difficulty of assembly. AI chips need to be welded and packaged with high precision to ensure their stable performance and do not affect the overall thickness and appearance of the mobile phone case. The installation position and angle of the sensor also need to be precisely controlled, otherwise it may not be able to accurately perceive external environmental information or user operation instructions. The antenna design and layout of the wireless communication module are also critical, which must ensure the stability and strength of signal transmission and avoid electromagnetic interference with other components. At the same time, the connecting wires between the components need to be reasonably planned and routed to prevent problems such as line entanglement and short circuit. As the size of these electronic components is getting smaller and smaller and the precision requirements are getting higher and higher, manual assembly is not only inefficient, but also prone to errors, making it difficult to meet the needs of large-scale production. This is also one of the important difficulties in the production process.

There are also many challenges in the process of combining the ink screen with the mobile phone shell. On the one hand, it is necessary to ensure that the ink screen fits tightly with the shell to avoid problems such as bubbles and gaps, otherwise it will affect the display effect and aesthetics, and may also allow moisture, dust, etc. to enter the inside of the mobile phone shell and damage the electronic components. On the other hand, the selection and processing technology of the shell material should be considered. The shell material needs to have good wear resistance, impact resistance and certain flexibility to protect the internal components and adapt to different usage scenarios. However, there are differences in the compatibility of different shell materials with the ink screen, and problems such as chemical reactions or physical deformation may occur during the combination process. For example, the high temperature generated by some plastic shells during the injection molding process may damage the ink screen; while the metal shell may interfere with the wireless signal transmission. In addition, the surface treatment process of the shell, such as spraying, coating, etc., also needs to be coordinated with the display effect of the ink screen, which further increases the complexity of the production process.

In the face of the above-mentioned production process difficulties, realizing automated production is a key way to improve production efficiency and product quality. In the production link of the ink screen, automated microcapsule preparation equipment and electrode manufacturing equipment can be introduced. Through a high-precision automated production line, the various parameters of the microcapsule and the manufacturing process of the electrode can be accurately controlled to improve the yield and production efficiency of the ink screen. For example, the use of automated microcapsule spraying equipment can evenly spray microcapsules on the substrate to avoid errors caused by manual operation; the use of automated electrode printing equipment can achieve high-precision printing of electrodes to ensure the flatness and conductivity of the electrodes. At the same time, the ink screen is monitored and screened in real time through automated testing equipment, unqualified products are removed in time, and production costs are reduced.

In the component assembly process, automated mounting equipment and welding equipment can greatly improve assembly accuracy and efficiency. Using surface mounting technology (SMT), AI chips, sensors, wireless communication modules and other electronic components are accurately mounted on the circuit board through automated mounting machines, and then reflow soldering equipment is used for welding, which can ensure the stability and consistency of welding quality. In addition, automated testing equipment can perform comprehensive testing on the assembled circuit board, including electrical performance testing, functional testing, etc., to detect and eliminate faults in time and improve product reliability. At the same time, the use of automated mechanical arms and fixtures can realize automatic connection and wiring between components, avoid line winding and short circuit problems in manual operation, and improve assembly efficiency and quality.

In the process of combining the ink screen and the shell, automated bonding equipment and shell processing equipment can effectively solve the problem of combining the process. Automated bonding equipment can achieve close fitting between the ink screen and the shell through vacuum adsorption, pressure control and other technologies to avoid bubbles and gaps. At the same time, according to different shell materials and processing techniques, the use of automated injection molding machines, stamping machines and other equipment for shell manufacturing can accurately control the size and shape of the shell to ensure a perfect match with the ink screen. For example, for plastic shells, an automated injection molding process can be used to produce a shell that meets the requirements through precise mold design and precise control of temperature and pressure; for metal shells, automated stamping and processing equipment can be used for cutting, grinding, polishing and other processes to improve the quality and aesthetics of the shell. In addition, automated surface treatment equipment, such as spraying robots, coating machines, etc., can realize the automated operation of the shell surface treatment process to ensure the consistency and stability of the surface treatment effect.
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